die attach meaning in English
晶粒安装管芯安装
Examples
- Auto - die attaching machine
自动灌胶机 - Plasma systems 400 and 660 are low - pressure microwave plasma systems for cleaning advanced chip packages prior to die attach , wire bond and encapsulation
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。 - However , the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling . c - sam is employed to investigate the delamination in the underfilled samples . highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board , coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper
充胶样品粗化尤为严重； ? ni - sn金属间化合物包括两层：其中，靠近ni焊盘的那层比较平整，同时， eds结果分析表明其化学式近似为nisn ，而靠近焊料的那层呈板条状，化学式近似为nisn _ 3 ，文献表明其为亚稳相； ?充胶使得样品最大应力范围降了接近一个数量级并降低了dnp的作用，同时，器件失效模式变为芯片粘接层分层； ? c - sam结果表明本论文采用的充胶样品，芯片粘接层分层起始于500周左右，而经过2700周循环的样品，分层几乎扩展到整个界面。